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Brand Name : UNICOMP
Model Number : AX8200
Certification : CE, FDA
Place of Origin : China
MOQ : 1Set
Price : can negotiate
Payment Terms : T/T, L/C
Supply Ability : 300 sets per month
Delivery Time : 30 days
Packaging Details : Wooden Case, Waterproof, Anti-collision
Name : Electronics X Ray Machine
Application : SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage : 100KV
Max.Voltage : 90kV/100kV
X ray tube type : closed
X-ray Leakage : < 1uSv/h
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection
The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)
 
 
OUR SERVICE
 
1. Your inquiry will be replied in 12 hours.
 
2. Original Manufacture to customers, with competitive price.
 
3. We provide one year warranty, free training and whole life technology support.
 
4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
and will give you the tracking NO. after shipment.
  
5. Well-trained and Professional after-sales service team to support you.
 
6. Manual will package with machine . It will show you how to use machine step by step.
 
7. Items are only shipped after payment is received.
  
 
Applications
 
BGA Inspection
 
Inspection of over molded electrical connectors
 
Encapsulated components
 
Aluminum die castings
 
Molded plastic components
 
Ceramics
 
Aerospace components
 
Electrical / mechanical components
 
Electronic components
 
SMT assemblies
 
Pharmaceuticals
 
Automotive assemblies
 
Agriculture
 
Counterfeit inspection
 
Cell phone battery inspection
 
| Item | Definition | Specs | 
| System Parameters | Size | 1080(L)x1180(W)x1730(H)mm | 
| Weight | 1150kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.8kW | |
| X-ray Tube | Type | Closed | 
| Max.Voltage | 90kV/100kV | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | 4"Image Intensifier | 
| Monitor | 22"LCD | |
| System Magnification | 600x | |
| Detection Region | Max.Loading Size | 510mm x 420mm | 
| Max.Inspection Area | 435mm x 385mm | |
| X-ray Leakage | < 1uSv/h | |
|   | 
| EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection Images | 
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