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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Name: Unicomp AX9100max Xray Inspection System For FlipChip BGA FCBGA Packaging Analysis
Brand: UNICOMP
Price: 1 USD

Cheap Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis for sale

Brand Name : UNICOMP

Model Number : AX9100max

Certification : CE, FDA

Place of Origin : China

MOQ : 1 set

Price : can negotiate

Payment Terms : L/C,T/T

Supply Ability : 100set/montrh

Delivery Time : 15 days

Packaging Details : Unicomp Wood.

Monitor : 27 "HD display

System OS : Windows10 64-bit

Hard Disk : 1TB

RAM : 16G

CPU Model : i7

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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

The Unicomp AX9100max X-ray Inspection Systemis engineered specifically for IGBT module analysis and serves a broad range of industries, including:

BGA/CSP/Flip Chip packaging

LED & optoelectronic components

Fuse & diode manufacturing

PCB & semiconductor assembly

Battery production

Small metal castings

Electronic connector modules & cables

Photovoltaic (PV) cell inspection

Application Fields

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Application fields of Unicomp AX9100max X-ray Machine

Functions and Features

Functions and features of Unicomp AX9100max X-ray Machine

Inspection Image

Sample inspection image from Unicomp AX9100max X-ray Machine

Technical Parameters and Specifications

Technical specifications of Unicomp AX9100max X-ray Machine

Dimensions and Appearance

Dimensions and appearance of Unicomp AX9100max X-ray Machine

Product Tags:

Unicomp AX9100max X-ray inspection system

Flip-Chip BGA X-ray machine

FCBGA packaging analysis equipment

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis Images

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